DocumentCode
2724756
Title
Generic thermal analysis for phone and tablet systems
Author
Gurrum, Siva P. ; Edwards, Darvin R. ; Marchand-Golder, Thomas ; Akiyama, Jotaro ; Yokoya, Satoshi ; Drouard, Jean-Francois ; Dahan, Franck
Author_Institution
Texas Instrum., Inc., Dallas, TX, USA
fYear
2012
fDate
May 29 2012-June 1 2012
Firstpage
1488
Lastpage
1492
Abstract
Thermal management of handheld systems such as smart phones and tablet systems is becoming increasingly challenging due to increasing power dissipation. These mobile systems pose a significant challenge for implementation of traditional cooling schemes such as heat sinks and fans due to form factor limitations. Instead, new advanced cooling schemes have been developed. This article presents thermal model development from an analysis of today´s smart phone thermal management schemes and application of these techniques to a tablet system. Application processor temperature rise and tablet skin temperature are reported for thermal enhancement simulations using this tablet system. Some guiding principles are provided for efficient thermal design of handheld systems.
Keywords
cooling; fans; heat sinks; smart phones; thermal management (packaging); application processor; cooling; fans; generic thermal analysis; handheld systems; heat sinks; power dissipation; smart phones; tablet skin temperature; tablet system; temperature rise; thermal management; Batteries; Conductivity; Heating; Smart phones; Temperature; Temperature measurement; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4673-1966-9
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2012.6249032
Filename
6249032
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