• DocumentCode
    2724756
  • Title

    Generic thermal analysis for phone and tablet systems

  • Author

    Gurrum, Siva P. ; Edwards, Darvin R. ; Marchand-Golder, Thomas ; Akiyama, Jotaro ; Yokoya, Satoshi ; Drouard, Jean-Francois ; Dahan, Franck

  • Author_Institution
    Texas Instrum., Inc., Dallas, TX, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1488
  • Lastpage
    1492
  • Abstract
    Thermal management of handheld systems such as smart phones and tablet systems is becoming increasingly challenging due to increasing power dissipation. These mobile systems pose a significant challenge for implementation of traditional cooling schemes such as heat sinks and fans due to form factor limitations. Instead, new advanced cooling schemes have been developed. This article presents thermal model development from an analysis of today´s smart phone thermal management schemes and application of these techniques to a tablet system. Application processor temperature rise and tablet skin temperature are reported for thermal enhancement simulations using this tablet system. Some guiding principles are provided for efficient thermal design of handheld systems.
  • Keywords
    cooling; fans; heat sinks; smart phones; thermal management (packaging); application processor; cooling; fans; generic thermal analysis; handheld systems; heat sinks; power dissipation; smart phones; tablet skin temperature; tablet system; temperature rise; thermal management; Batteries; Conductivity; Heating; Smart phones; Temperature; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249032
  • Filename
    6249032