• DocumentCode
    2724898
  • Title

    Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides

  • Author

    Ito, Yuka ; Terada, Shinsuke ; Singh, Mayank Kumar ; Arai, Shinya ; Choki, Koji

  • Author_Institution
    Opt. Interconnection Bus. Dev. Dept., Sumitomo Bakelite Co., Ltd., Utsunomiya, Japan
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1526
  • Lastpage
    1531
  • Abstract
    We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.
  • Keywords
    flexible electronics; flip-chip devices; integrated optoelectronics; micromirrors; optical interconnections; optical transceivers; optical waveguides; photodiodes; printed circuits; surface emitting lasers; 24-channel polynorbornene waveguides; O/E module fabrication; VCSEL; board level interconnects; bonding sheets; flexible optoelectronic transceiver module; flexible printed circuit; flip-chip assembly; high-bandwidth data transmission; low-crosstalk polynorbornene waveguides; low-loss polynorbornene waveguides; micromirrors; optical linked O/E transceiver module; packaging process; photodiodes; vertical-cavity surface-emitting laser diodes; wavelength 850 nm; Data communication; Loss measurement; Optical crosstalk; Optical device fabrication; Optical interconnections; Optical losses; Optical waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249038
  • Filename
    6249038