DocumentCode :
2724905
Title :
A comparative numerical simulation of a nanoscaled body on Insulator FinFET
Author :
Anwar, Ashfaqul ; Hossain, Imran
Author_Institution :
Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
fYear :
2010
fDate :
16-19 May 2010
Firstpage :
413
Lastpage :
416
Abstract :
In this paper a FinFET structure with channel region insulated from body by buried oxide(Body Over Insulator) is proposed. Body Over Insulator (BOI) FinFET has advantage over both Silicon Over Insulator(SOI) and Bulk FinFETs. Here, a comparative numerical study of a BOI FinFET, a bulk FinFET and a SOI FinFET is presented. The result have shown that, the proposed BOI FinFET has better short channel effect(SCE) suppression and a lower threshold voltage than bulk FinFET. Better heat dissipation capability by virtue of a smaller insulation, ease of fabrication and acceptable SCE suppression makes this structure a viable competitor of the SOI structure.
Keywords :
MOSFET; silicon-on-insulator; FinFET structure; SOI FinFET; body over insulator FinFET; bulk FinFET; channel region; comparative numerical simulation; heat dissipation; nanoscaled body on insulator FinFET; short channel effect suppression; silicon over insulator; threshold voltage; CMOS technology; FETs; Fabrication; FinFETs; Impurities; Insulation; Leakage current; Numerical simulation; Silicon on insulator technology; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics Proceedings (MIEL), 2010 27th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-7200-0
Type :
conf
DOI :
10.1109/MIEL.2010.5490451
Filename :
5490451
Link To Document :
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