Title :
On randomness and reliability of electronic devices: A case-study of thick dielectrics
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
In a recent article, the author discussed the growing importance of process-related variability and stress-induced reliability in electronic devices and how it complicates the design of complex IC predicated on transistors of identical characteristics. Various circuit techniques developed to address these variability and reliability issues were also discussed. In this article, I continue the discussion emphasizing that the problems of variability and reliability are connected at more nuanced and fundamental levels. I use the theory of dielectric breakdown of thick insulators relevant for wide variety of practical problems to illustrate this connection.
Keywords :
dielectric materials; integrated circuit design; integrated circuit reliability; transistor circuits; complex IC design; electronic devices; process-related variability; stress-induced reliability; thick dielectrics; transistors; Circuits; Dielectric breakdown; Dielectric devices; Dielectrics and electrical insulation; Electric breakdown; Electrons; Fluctuations; Ionization; Reliability theory; Resource description framework;
Conference_Titel :
Microelectronics Proceedings (MIEL), 2010 27th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-7200-0
DOI :
10.1109/MIEL.2010.5490452