• DocumentCode
    2724914
  • Title

    On randomness and reliability of electronic devices: A case-study of thick dielectrics

  • Author

    Alam, M.A.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2010
  • fDate
    16-19 May 2010
  • Firstpage
    419
  • Lastpage
    425
  • Abstract
    In a recent article, the author discussed the growing importance of process-related variability and stress-induced reliability in electronic devices and how it complicates the design of complex IC predicated on transistors of identical characteristics. Various circuit techniques developed to address these variability and reliability issues were also discussed. In this article, I continue the discussion emphasizing that the problems of variability and reliability are connected at more nuanced and fundamental levels. I use the theory of dielectric breakdown of thick insulators relevant for wide variety of practical problems to illustrate this connection.
  • Keywords
    dielectric materials; integrated circuit design; integrated circuit reliability; transistor circuits; complex IC design; electronic devices; process-related variability; stress-induced reliability; thick dielectrics; transistors; Circuits; Dielectric breakdown; Dielectric devices; Dielectrics and electrical insulation; Electric breakdown; Electrons; Fluctuations; Ionization; Reliability theory; Resource description framework;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics Proceedings (MIEL), 2010 27th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-7200-0
  • Type

    conf

  • DOI
    10.1109/MIEL.2010.5490452
  • Filename
    5490452