DocumentCode
2724914
Title
On randomness and reliability of electronic devices: A case-study of thick dielectrics
Author
Alam, M.A.
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear
2010
fDate
16-19 May 2010
Firstpage
419
Lastpage
425
Abstract
In a recent article, the author discussed the growing importance of process-related variability and stress-induced reliability in electronic devices and how it complicates the design of complex IC predicated on transistors of identical characteristics. Various circuit techniques developed to address these variability and reliability issues were also discussed. In this article, I continue the discussion emphasizing that the problems of variability and reliability are connected at more nuanced and fundamental levels. I use the theory of dielectric breakdown of thick insulators relevant for wide variety of practical problems to illustrate this connection.
Keywords
dielectric materials; integrated circuit design; integrated circuit reliability; transistor circuits; complex IC design; electronic devices; process-related variability; stress-induced reliability; thick dielectrics; transistors; Circuits; Dielectric breakdown; Dielectric devices; Dielectrics and electrical insulation; Electric breakdown; Electrons; Fluctuations; Ionization; Reliability theory; Resource description framework;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Proceedings (MIEL), 2010 27th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-7200-0
Type
conf
DOI
10.1109/MIEL.2010.5490452
Filename
5490452
Link To Document