DocumentCode :
2724927
Title :
Single-mode glass waveguide platform for DWDM chip-to-chip interconnects
Author :
Brusberg, Lars ; Schröder, Henning ; Queisser, Marco ; Lang, Klaus-Dieter
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
1532
Lastpage :
1539
Abstract :
Due to high bandwidth potential, optical single-mode signal transmission is superior to electrical as well as optical multimode signal transmission. For years, optical single-mode fiber cables have been used in telecommunication networks. However, there is a lack of photonic system integration based on optical single-mode interconnects in printed circuit boards and modules for signal transmission between electro-optical components and optical fibers. Therefore, a thin glass-based photonic integration concept for single-mode signal transmission was developed. Optical waveguides and optical free space interconnects are integrated in a single or a stack of thin glass sheets for module and printed circuit board packaging. For light routing inside a thin glass sheet, a singlemode waveguide technology on wafer level (150 mm) was developed promising for scaling up on panel size (45 × 60 cm2). The waveguides show single-mode behavior, low propagation (0.05 dB/cm) and fiber coupling (- 0.3 dB) losses at wavelength of 1550 nm. Different waveguide structures such as 180°-bends, S-bends, splitters and crosses have been integrated in thin glass and characterized in detail. Coupling mechanism and misalignment loss has also been studied. Technologies for fiber laser joining on glass as well as laser structuring of an optical mirror are introduced and first results are presented. Generic module and board-based photonic packaging solutions can be put into practice by applying all introduced technologies and will be demonstrated for a chip-to-fiber module package platform.
Keywords :
chip-on-board packaging; optical cables; optical interconnections; optical waveguides; printed circuits; wafer level packaging; DWDM chip-to-chip interconnects; board-based photonic packaging solutions; chip-to-fiber module package platform; coupling mechanism; electro-optical components; fiber laser joining; generic module; laser structuring; light routing; misalignment loss; optical free space interconnects; optical mirror; optical multimode signal transmission; optical single-mode fiber cables; optical single-mode interconnects; optical single-mode signal transmission; optical waveguides; photonic system integration; printed circuit board packaging; printed circuit boards; single-mode glass waveguide platform; telecommunication networks; thin glass sheets; thin glass-based photonic integration concept; wafer level; wavelength 1550 nm; Couplings; Glass; Integrated optics; Optical fibers; Optical interconnections;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6249039
Filename :
6249039
Link To Document :
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