• DocumentCode
    2724927
  • Title

    Single-mode glass waveguide platform for DWDM chip-to-chip interconnects

  • Author

    Brusberg, Lars ; Schröder, Henning ; Queisser, Marco ; Lang, Klaus-Dieter

  • Author_Institution
    Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1532
  • Lastpage
    1539
  • Abstract
    Due to high bandwidth potential, optical single-mode signal transmission is superior to electrical as well as optical multimode signal transmission. For years, optical single-mode fiber cables have been used in telecommunication networks. However, there is a lack of photonic system integration based on optical single-mode interconnects in printed circuit boards and modules for signal transmission between electro-optical components and optical fibers. Therefore, a thin glass-based photonic integration concept for single-mode signal transmission was developed. Optical waveguides and optical free space interconnects are integrated in a single or a stack of thin glass sheets for module and printed circuit board packaging. For light routing inside a thin glass sheet, a singlemode waveguide technology on wafer level (150 mm) was developed promising for scaling up on panel size (45 × 60 cm2). The waveguides show single-mode behavior, low propagation (0.05 dB/cm) and fiber coupling (- 0.3 dB) losses at wavelength of 1550 nm. Different waveguide structures such as 180°-bends, S-bends, splitters and crosses have been integrated in thin glass and characterized in detail. Coupling mechanism and misalignment loss has also been studied. Technologies for fiber laser joining on glass as well as laser structuring of an optical mirror are introduced and first results are presented. Generic module and board-based photonic packaging solutions can be put into practice by applying all introduced technologies and will be demonstrated for a chip-to-fiber module package platform.
  • Keywords
    chip-on-board packaging; optical cables; optical interconnections; optical waveguides; printed circuits; wafer level packaging; DWDM chip-to-chip interconnects; board-based photonic packaging solutions; chip-to-fiber module package platform; coupling mechanism; electro-optical components; fiber laser joining; generic module; laser structuring; light routing; misalignment loss; optical free space interconnects; optical mirror; optical multimode signal transmission; optical single-mode fiber cables; optical single-mode interconnects; optical single-mode signal transmission; optical waveguides; photonic system integration; printed circuit board packaging; printed circuit boards; single-mode glass waveguide platform; telecommunication networks; thin glass sheets; thin glass-based photonic integration concept; wafer level; wavelength 1550 nm; Couplings; Glass; Integrated optics; Optical fibers; Optical interconnections;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249039
  • Filename
    6249039