DocumentCode
2724989
Title
Plastic injection micromolding of THz circuits and microfluidic sensors
Author
Park, Kyoung Youl ; Wiwatcharagoses, Nophadon ; Silveira, Cecilia Acosta ; Chahal, Prem
Author_Institution
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
fYear
2012
fDate
May 29 2012-June 1 2012
Firstpage
1562
Lastpage
1566
Abstract
In this paper, THz circuits and sensors are designed and experimentally implemented using a cost effective plastic injection micromolding process. Plastic resin, having low refractive index and loss in THz region, was used as the base material to manufacture THz circuits. Periodic structures such as photonic bandgap (PBG) were utilized to design THz circuits and sensors. Numerical simulations were performed using the finite element method (FEM). Design, fabrication and characterization were carried out for THz circuits operating at a center frequency of 0.25 THz. The fabricated circuits were combined with microfluidics to demonstrate sensor applications. This proposed fabrication method is useful in low cost fabrication and massive production of THz circuits and sensors.
Keywords
finite element analysis; microfluidics; microsensors; moulding; photonic band gap; refractive index; submillimetre wave circuits; THz circuits; THz sensors; finite element method; microfluidic sensors; numerical simulations; periodic structures; photonic bandgap; plastic injection micromolding; plastic resin; refractive index; Fabrication; Liquids; Metals; Methanol; Microfluidics; Plastics; Sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4673-1966-9
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2012.6249043
Filename
6249043
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