DocumentCode :
2725212
Title :
High-density capacitors with conformal high-k dielectrics on etched-metal foils
Author :
Chakraborti, Parthasarathi ; Sharma, Himani ; Raj, P. Markondeya ; Tummala, Rao
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
1640
Lastpage :
1643
Abstract :
This paper describes the fabrication and characterization of high-density capacitors using etched-metal foils as high-surface area electrodes. High permittivity films were conformally-formed over the metal foils using an anodization reaction. The approach was demonstrated with two material systems, viz., etched aluminum foils and porous titanium foils. Both the metal anodizations were carried out with aqueous solution of citric acid as electrolytes. The electrical properties of the etched-foil capacitor were measured using a sulfuric acid solution as the top contact. The high surface area electrodes yielded very high capacitance densities of 35-40 μF/cm2.
Keywords :
aluminium; capacitors; etching; semiconductor device manufacture; titanium; Al; Ti; anodization reaction; aqueous solution; citric acid; conformal high-k dielectrics; electrolytes; etched-metal foils; high permittivity films; high-density capacitors; high-surface area electrodes; sulfuric acid solution; Aluminum; Capacitance; Capacitors; Electrodes; Surface treatment; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6249057
Filename :
6249057
Link To Document :
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