Title :
Void formation during reflow soldering
Author :
Ewald, Thomas D. ; Holle, Norbert ; Wolter, Klaus-Jürgen
fDate :
May 29 2012-June 1 2012
Abstract :
In the present study the interaction between solder paste and the PCB surface finish and its impact on void formation was investigated. Therefore, a comprehensive set of tests was performed on test vehicles with different diameter of the solder powder, solder alloy composition, PCB surface finish and flux chemistry. Based on these experimental results a hypothesis of void generating mechanisms is presented characterizing the wetting process.
Keywords :
printed circuit testing; reflow soldering; solders; wetting; PCB surface finish; flux chemistry; reflow soldering; solder alloy composition; solder paste; solder powder; test vehicles; void formation; void generating mechanisms; wetting process; Adhesives; Lead; Soldering; Surface finishing; Tin;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6249064
