• DocumentCode
    2725491
  • Title

    Optimized reliability test design to reduce uncertainties in reliability assessment

  • Author

    Kwon, Daeil ; Lucero, Alan E.

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1726
  • Lastpage
    1730
  • Abstract
    Manufacturers are always asked to deliver products faster while satisfying customer expectations including reliability. Customers cannot wait until they receive their products to assess if the products are reliable. Capability of accurate reliability assessment should yield important information about the likelihood that the manufacturer will provide a reliable product, and therefore add valuable competitive advantage to manufacturer. In the electronics industry, accelerated life testing such as temperature cycling is often used to assess the reliability of products. Careful planning of test conditions such as test duration and sample size is essential, as they directly influence the reliability assessment. Although some industry standards provide guidelines in terms of reliability goals to achieve, uncertainties in reliability assessment associated with test duration and sample size is not clearly defined for most cases. This paper presents sample size and test duration recommendation for knowledge based certification to reduce uncertainties in reliability assessment regardless of stress conditions. Numerical simulations have been conducted in order to determine the appropriate sample size and test duration by generating random time-to-failures from a Weibull distribution. The probability of obtaining accurate reliability assessment is provided according to sample size. Censoring plan is also considered to determine the least test duration. Moreover, temperature cycling tests have been conducted with the minimum sample size identified from this study and various censoring points in order to compare the reliability characteristics. The experimental results were found to be in good agreement with the findings from numerical simulations.
  • Keywords
    Weibull distribution; electronics industry; life testing; numerical analysis; product design; reliability; Weibull distribution; accelerated life testing; customer expectations; electronics industry; manufacturer; numerical simulations; optimized reliability test design; probability; product reliability; random time-to-failures; reliability assessment; stress conditions; temperature cycling tests; test condition planning; test duration; test duration recommendation; uncertainty reduction; Accuracy; Estimation; Reliability engineering; Shape; Standards; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249070
  • Filename
    6249070