Title :
A compact thermal model to predict the junction temperature of high power light emitting diode package
Author :
Hu, Run ; Mao, Zhangming ; Zheng, Huai ; Chen, Quan ; Liu, Sheng ; Luo, Xiaobing
Author_Institution :
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fDate :
May 29 2012-June 1 2012
Abstract :
In this study, the thermal resistance of a typical LED package was analyzed and a compact thermal model (CTM) was obtained by considering the configuration of each layer of LED package. The building of the CTM was presented in detail. Experiments and finite element simulations were conducted to validate the CTM. The error of the thermal resistance obtained by the CTM and simulations were less than 2% when being referred to the experiments. The comparison results demonstrate that the present CTM can be used to obtain the thermal resistance of the package and to predict the junction temperature.
Keywords :
electronics packaging; finite element analysis; light emitting diodes; thermal resistance; CTM; LED package; compact thermal model; finite element simulations; high power light emitting diode package; junction temperature prediction; thermal resistance; Copper; Electronic packaging thermal management; Junctions; Light emitting diodes; Resistance heating; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6249079
