Refined but handy electrical models of TSV usable from low to high density and for RF or fast digital signals in 3D-IC

In this paper, new analytic models of TSV are proposed in a wide band of frequencies (DC-40GHz). These models are defined with a RLCG transmission line model in two specific configurations, a two TSV line and a often called "H-type" line of three TSV. Each RLCG parameters are compared to those extracted from electromagnetic modeling in a wide band of frequencies. Finally, a last comparison is made between analytical RLCG parameters and those extracted from measurements in a typical "H-type" case of medium density TSV with a specific methodology.