• DocumentCode
    2726214
  • Title

    Increasing yields with entropy-based analysis of test data

  • Author

    Engler, Joseph

  • Author_Institution
    GS Test Eng., Rockwell Collins, Inc., Cedar Rapids, IA, USA
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Manufacturing test data is often analyzed with the direct goal of increasing production yields and reduction of variance within the product. Six Sigma and statistical process control methodologies are the standard tool sets for analysis of test data. The normal course of events results in the analyst seeking to reduce failures by taking steps to correct the tests that fail most often. Unfortunately, the complex nature of modern electronics is such that the systems often exhibit chaotic dynamics with self-organized criticality. In these particular cases standard analysis, such as Six Sigma, and correcting the tests which fail most often, are insufficient due to the chaotic nature of the data. This paper presents an entropy-based analysis of these particular types of systems. The algorithms for detection of self-organized criticality and chaotic dynamics within the test data are given. Corrective action solutions are also offered to assist in dealing with the chaotic dynamics in these systems. Finally, a case study is presented in which the given analysis techniques were utilized to effect a 52% yield increase on a product at Rockwell Collins.
  • Keywords
    chaos; data analysis; entropy; manufacturing systems; production testing; six sigma (quality); statistical process control; Six Sigma; chaotic dynamics; corrective action solution; entropy based analysis; manufacturing test data; self-organized criticality; statistical process control methodology; test data analysis; Chaotic communication; Complexity theory; Delay effects; Entropy; Measurement; Testing; data analysis; entropy analysis; nonlinear dynamics; test data; yield increase;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    AUTOTESTCON, 2010 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1088-7725
  • Print_ISBN
    978-1-4244-7960-3
  • Type

    conf

  • DOI
    10.1109/AUTEST.2010.5613624
  • Filename
    5613624