• DocumentCode
    2726624
  • Title

    Vertically aligned nickel nanowire/epoxy composite for electrical and thermal conducting material

  • Author

    Lee, Hyeong-Gi ; Paik, Kyung-Wook

  • Author_Institution
    Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    2087
  • Lastpage
    2090
  • Abstract
    The vertically aligned nickel nanowire/epoxy composite for electrical and thermal conducting material was investigated in this research. The nickel nanowires were synthesized by template-assisted electro-deposition method using a high aspect-ratio anodic aluminum oxide (AAO) membrane. The diameter of the nickel nanowire was 200 nm, and the length of the nanowires was around 30 μm. The nickel nanowires were able to align vertically under external magnetic field while curing due to the ferromagnetic property of nickel nanowires. Epoxy with the nickel nanowires arranged in the horizontal and the vertical orientations along the applied external magnetic field of 300 ± 50 Gauss. The optical microscope images and Scanning Electron Microscopy (SEM) images revealed a good alignment of the nickel nanowires along with the external magnetic field.
  • Keywords
    aluminium compounds; composite materials; conducting materials; electrodeposition; electronics packaging; ferromagnetic materials; light emitting diodes; magnetic fields; nanowires; nickel; optical microscopes; scanning electron microscopy; AAO membrane; AlO; LED package; Ni; SEM images; electrical conducting material; epoxy composite; ferromagnetic property; high aspect-ratio anodic aluminum oxide membrane; magnetic field; optical microscope images; scanning electron microscopy; size 200 nm; template-assisted electrodeposition method; thermal conducting material; vertically aligned nickel nanowire; Magnetic anisotropy; Magnetic fields; Materials; Nickel; Optical imaging; Scanning electron microscopy; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249129
  • Filename
    6249129