DocumentCode
2726624
Title
Vertically aligned nickel nanowire/epoxy composite for electrical and thermal conducting material
Author
Lee, Hyeong-Gi ; Paik, Kyung-Wook
Author_Institution
Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea
fYear
2012
fDate
May 29 2012-June 1 2012
Firstpage
2087
Lastpage
2090
Abstract
The vertically aligned nickel nanowire/epoxy composite for electrical and thermal conducting material was investigated in this research. The nickel nanowires were synthesized by template-assisted electro-deposition method using a high aspect-ratio anodic aluminum oxide (AAO) membrane. The diameter of the nickel nanowire was 200 nm, and the length of the nanowires was around 30 μm. The nickel nanowires were able to align vertically under external magnetic field while curing due to the ferromagnetic property of nickel nanowires. Epoxy with the nickel nanowires arranged in the horizontal and the vertical orientations along the applied external magnetic field of 300 ± 50 Gauss. The optical microscope images and Scanning Electron Microscopy (SEM) images revealed a good alignment of the nickel nanowires along with the external magnetic field.
Keywords
aluminium compounds; composite materials; conducting materials; electrodeposition; electronics packaging; ferromagnetic materials; light emitting diodes; magnetic fields; nanowires; nickel; optical microscopes; scanning electron microscopy; AAO membrane; AlO; LED package; Ni; SEM images; electrical conducting material; epoxy composite; ferromagnetic property; high aspect-ratio anodic aluminum oxide membrane; magnetic field; optical microscope images; scanning electron microscopy; size 200 nm; template-assisted electrodeposition method; thermal conducting material; vertically aligned nickel nanowire; Magnetic anisotropy; Magnetic fields; Materials; Nickel; Optical imaging; Scanning electron microscopy; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4673-1966-9
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2012.6249129
Filename
6249129
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