Title :
Impact of underfill filler particles on reliability of flip chip interconnects
Author :
Darbha, K. ; Okura, J.H. ; Dasgupta, A.
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Abstract :
Parametric analytical studies are conducted to investigate whether the reliability of flip chip solder interconnects are affected by underfill inhomogeneities, such as settling of the filler particles. The property gradation caused by filler settling is modelled with a micromechanical formulation. The predicted property gradients are then utilized in a finite element simulation of the flip chip assembly, to assess the impact on solder interconnect reliability
Keywords :
assembling; circuit reliability; electronic engineering computing; encapsulation; filled polymers; finite element analysis; flip-chip devices; integrated circuit packaging; particle reinforced composites; soldering; filler particle settling; filler settling; finite element simulation; flip chip assembly; flip chip interconnects; flip chip solder interconnects; micromechanical model; parametric analysis; property gradients; reliability; solder interconnect reliability; underfill filler particles; underfill inhomogeneities; Fatigue; Flip chip; Packaging; Polymers; Semiconductor devices; Semiconductor materials; Silicon compounds; Soldering; Substrates; Temperature;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656501
