Impact of underfill filler particles on reliability of flip chip interconnects

Author

Darbha, K. ; Okura, J.H. ; Dasgupta, A.

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

fYear

1997

fDate

26-30 Oct 1997

Firstpage

284

Lastpage

292

Abstract

Parametric analytical studies are conducted to investigate whether the reliability of flip chip solder interconnects are affected by underfill inhomogeneities, such as settling of the filler particles. The property gradation caused by filler settling is modelled with a micromechanical formulation. The predicted property gradients are then utilized in a finite element simulation of the flip chip assembly, to assess the impact on solder interconnect reliability

Keywords

assembling; circuit reliability; electronic engineering computing; encapsulation; filled polymers; finite element analysis; flip-chip devices; integrated circuit packaging; particle reinforced composites; soldering; filler particle settling; filler settling; finite element simulation; flip chip assembly; flip chip interconnects; flip chip solder interconnects; micromechanical model; parametric analysis; property gradients; reliability; solder interconnect reliability; underfill filler particles; underfill inhomogeneities; Fatigue; Flip chip; Packaging; Polymers; Semiconductor devices; Semiconductor materials; Silicon compounds; Soldering; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on

Conference_Location

Norrkoping

Print_ISBN

0-7803-3865-0

Type

conf

DOI

10.1109/PEP.1997.656501

Filename

656501