DocumentCode
2727256
Title
Dynamic voltage assignment for thermal-constrained task scheduler on 3D multi-core processors
Author
Chien-Hui Liao ; Yu-Ze Lin ; Wen, Charles H.-P
Author_Institution
Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2015
fDate
27-29 April 2015
Firstpage
1
Lastpage
4
Abstract
Thermal-constrained task scheduler for throughput optimization on 3D multi-core processors (3D-MCPs) has been studied extensively. Most task scheduler focused on thermal-aware task allocation to reduce hotspots, thereby maximizing throughput under thermal constraints. Rather than focusing on the thermal-aware task allocation as previous work does, this work targets on the voltage assignment. In this paper, dynamic voltage assignment is proposed to pre-emptively assign different voltage levels to cores frequently for reducing temperature increase in 3D-MCPs. Experimental results show that two previous task schedulers integrated with the proposed dynamic voltage assignment can lower hotspot occurrences by 62.31% and 59.09%, and improve throughput by 18.28% and 18.35%, respectively. As a result, task schedulers integrated with the proposed dynamic voltage assignment can be more effective to reduce occurrences of hotspots and optimize throughput for 3D-MCPs under thermal constraints.
Keywords
multiprocessing systems; optimisation; task analysis; thermal analysis; three-dimensional integrated circuits; 3D multicore processors; 3D-MCP; dynamic voltage assignment; hotspot reduction; temperature reduction; thermal-aware task allocation; thermal-constrained task scheduler; three-dimensional multicore processors; throughput optimization; Dynamic scheduling; Focusing; Multicore processing; Resource management; Three-dimensional displays; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-DAT.2015.7114495
Filename
7114495
Link To Document