• DocumentCode
    2727256
  • Title

    Dynamic voltage assignment for thermal-constrained task scheduler on 3D multi-core processors

  • Author

    Chien-Hui Liao ; Yu-Ze Lin ; Wen, Charles H.-P

  • Author_Institution
    Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2015
  • fDate
    27-29 April 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Thermal-constrained task scheduler for throughput optimization on 3D multi-core processors (3D-MCPs) has been studied extensively. Most task scheduler focused on thermal-aware task allocation to reduce hotspots, thereby maximizing throughput under thermal constraints. Rather than focusing on the thermal-aware task allocation as previous work does, this work targets on the voltage assignment. In this paper, dynamic voltage assignment is proposed to pre-emptively assign different voltage levels to cores frequently for reducing temperature increase in 3D-MCPs. Experimental results show that two previous task schedulers integrated with the proposed dynamic voltage assignment can lower hotspot occurrences by 62.31% and 59.09%, and improve throughput by 18.28% and 18.35%, respectively. As a result, task schedulers integrated with the proposed dynamic voltage assignment can be more effective to reduce occurrences of hotspots and optimize throughput for 3D-MCPs under thermal constraints.
  • Keywords
    multiprocessing systems; optimisation; task analysis; thermal analysis; three-dimensional integrated circuits; 3D multicore processors; 3D-MCP; dynamic voltage assignment; hotspot reduction; temperature reduction; thermal-aware task allocation; thermal-constrained task scheduler; three-dimensional multicore processors; throughput optimization; Dynamic scheduling; Focusing; Multicore processing; Resource management; Three-dimensional displays; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2015.7114495
  • Filename
    7114495