DocumentCode
272801
Title
Survey of recent advanced statistical models for early life failure probability assessment in semiconductor manufacturing
Author
Kurz, Daniel ; Lewitschnig, Horst ; Pilz, Jürgen
Author_Institution
Dept. of Stat., Alpen-Adria-Univ. Klagenfurt, Klagenfurt, Austria
fYear
2014
fDate
7-10 Dec. 2014
Firstpage
2600
Lastpage
2608
Abstract
In semiconductor manufacturing, early life failures have to be screened out before delivery. This is achieved by means of burn-in. With the aim to prove a target reliability level and release burn-in testing of the whole population, a burn-in study is performed, in which a large number of items is investigated for early life failures. However, from a statistical point of view, there is substantial potential for improvement with respect to the modeling of early life failure probabilities by considering further available information in addition to the performed burn-in studies. In this paper, we provide ideas on how advanced statistics can be applied to efficiently reduce the efforts of burn-in studies. These ideas involve scaling the failure probability with respect to the sizes of the different products, as well as taking advantage of synergies between different chip technologies within the estimation of the chips´ failure probability level.
Keywords
failure analysis; reliability; semiconductor device manufacture; semiconductor device testing; statistical analysis; advanced statistical models; burn-in testing; chip failure probability level; chip technologies; early life failure probability assessment; reliability level; semiconductor manufacturing; Bismuth; Estimation; Inspection; Probability; Production; Reliability; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference (WSC), 2014 Winter
Conference_Location
Savanah, GA
Print_ISBN
978-1-4799-7484-9
Type
conf
DOI
10.1109/WSC.2014.7020104
Filename
7020104
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