• DocumentCode
    2728136
  • Title

    Electroplating of Cu-NT onto metallic substrates

  • Author

    Sullivan, Mary ; Zheng, Min ; Hilty, Bob

  • Author_Institution
    Interconnection & Process Technol., Tyco Electron., Middletown, PA, USA
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    955
  • Lastpage
    959
  • Abstract
    This investigation has achieved semi-uniform coatings of single-walled carbon nanotubes (SWNT) onto copper substrates by electrodeposition from a metallic plating bath as well as electrophoretic deposition. Furthermore, SWNT mat was used as an electrode in which metallic ions were electrodeposited. CVD-produced SWNT were functionalized via agitation concentrated sulfuric acid/nitric acid. FTIR studies confirm the presence of carboxylic and hydroxyl groups on COOH-SWNT. COOH-SWNT were ultrasonicated in cetyl trimethylammonium bromide (CTAB), a cationic surfactant which lends a positive charge. The suspension was added to Cu and Ni metallic plating baths. Electrolytic deposition was carried out on plating baths containing COOH-SWNT. In addition, electrophoretic deposition was performed using COOH-SWNT dispersed in aqueous solutions of CTAB. Scanning Electron Microscope/Focused Ion Beam (SEM/FIB) was implemented to characterize nanotube dispersion as well as plating deposition, uniformity and morphology. SEM imaging of FIB cross-sections show limited uniformity of nanotube coatings, with agglomerations of varying sizes, depending on the nature of the deposition. Also observed is a morphological conformation of metallic ions to deposited COOH-SWNT. Finally, metallic deposition onto SWNT mat shows a uniform metallic layer on the surface as well as metallics within the nanotube matrix, indicative of diffusion occurring during the plating process. Current studies focus on the electrical performance of iso-metallic SWNT (iso-M-SWNT) as well as metallic substrates coated with pristine or COOH-SWNT. Contact resistance measurements were performed on iso-M-SWNT mat with a soft Au ball as the probe. Iso-M-SWNT mat containing 70% metallic nanotubes exhibit resistance values of approximately 450 mOhm upon a maximum force of 50 cN. The morphological and electrical characterization reported here was performed in an effort to enhance uniformity and dispersion of nanotube-plated metal- - s.
  • Keywords
    carbon nanotubes; copper; electroplating; scanning electron microscopy; surface morphology; Cu-NT; FIB cross-sections; FTIR studies; SEM imaging; agitation concentrated sulfuric acid; aqueous solutions; carboxylic group; cationic surfactant; cetyl trimethylammonium bromide; contact resistance measurements; copper substrates; electrical characterization; electrical performance; electrodeposition; electrolytic deposition; electrophoretic deposition; electroplating; focused ion beam; hydroxyl group; metallic deposition; metallic ions; metallic layer; metallic plating baths; metallic substrates; morphological characterization; morphological conformation; nanotube coatings; nanotube dispersion; nanotube matrix; nitric acid; plating deposition; plating process; positive charge; scanning electron microscope; semi-uniform coatings; single-walled carbon nanotubes; Carbon nanotubes; Coatings; Copper; Electrodes; Electron beams; Focusing; Ion beams; Scanning electron microscopy; Surface morphology; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490656
  • Filename
    5490656