DocumentCode :
2728359
Title :
Cost challenges on the way to the Internet of Things
Author :
Rhines, Walden C.
Author_Institution :
Mentor Graphics, Wilsonville, OR, USA
fYear :
2015
fDate :
27-29 April 2015
Firstpage :
1
Lastpage :
1
Abstract :
One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.
Keywords :
Internet of Things; intelligent actuators; intelligent sensors; low-power electronics; semiconductor device packaging; semiconductor devices; transistors; Internet of Things; IoT; big digital chips; diverse packaging; semiconductor components; semiconductor design; semiconductor production costs; smart actuators; smart sensors; transistor; ultralow power mixed signal design; Actuators; Complexity theory; Graphics; Information processing; Intelligent sensors; Internet of things; Low-power electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/VLSI-DAT.2015.7114553
Filename :
7114553
Link To Document :
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