Title :
RF MEMS wafer-level packaging using solder paste by via filling process
Author :
Jung, Sunghae ; Lee, Myunglae ; Moon, Jong-Tae
Author_Institution :
Convergence & Components & Mater. Res. Lab., ETRI, Daejeon, South Korea
Abstract :
In this paper, the design, fabrication technology, and experimental evaluation of the RF frequency performance of a new type of solder paste via filled through-wafer interconnects in silicon substrates are presented
Keywords :
Chemical lasers; Copper; Etching; Filling; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Wafer bonding; Wafer scale integration; rf mems; solder; switch; via;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2010.5490672
