Title :
Damping-factor-control frequency compensation technique for low-voltage low-power large capacitive load applications
Author :
Leung, A.K.N. ; Mok, Philip K. T. ; Wing Hung Ki ; Sin, Johnny K. O.
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Hong Kong
Abstract :
Frequency compensation techniques for multiple-stage amplifiers are becoming increasingly important as cascode configuration is not applicable to low-voltage design. Nested Miller compensation (NMC) is commonly used to stabilize multiple-stage amplifiers. However, the bandwidth of an NMC amplifier is poor. Several topologies such as multi-path nested Miller compensation (MNMC) and nested Gm-C compensation (NGCC) have been proposed to enhance the bandwidth. When compared to an NMC amplifier, MNMC can increase the bandwidth by approximately a factor of two while NGCC can further improve the stability of the amplifier. Nevertheless, the bandwidth enhancement by the two topologies is not sufficient for high-speed applications especially to drive large capacitive loads, such as the error amplifier in a low-voltage low-dropout regulator in portable electronic devices. A topology called damping-factor-control frequency compensation (DFCFC) for three-stage amplifiers significantly increases the bandwidth and improves the transient response of the amplifiers.
Keywords :
circuit stability; compensation; damping; differential amplifiers; low-power electronics; network topology; transient response; voltage regulators; bandwidth enhancement; capacitive loads; damping-factor-control frequency compensation; error amplifier; low-dropout regulator; low-power large capacitive load applications; low-voltage design; multiple-stage amplifiers; stability; three-stage amplifiers; transient response; Bandwidth; Capacitors; Circuit topology; Damping; Feedforward systems; Frequency; Regulators; Silicon compounds; Stability; Transient response;
Conference_Titel :
Solid-State Circuits Conference, 1999. Digest of Technical Papers. ISSCC. 1999 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5126-6
DOI :
10.1109/ISSCC.1999.759173