Yield modeling of 3D integrated wafer scale assemblies

3D Integration approaches exist for wafer-to-wafer, die-to-wafer, and die-to-die assembly, each with distinct merits. Creation of "seamless" wafer scale focal plane arrays on the order of 6–8” in diameter drives very demanding yield requirements and understanding. This work established a Monte Carlo model of our exploratory architecture in order to assess the trades of the various assembly methods. The model results suggested an optimum die size, number of die stacks per assembly, number of layers per stack, and quantified the value of sorting for optimizing the assembly process.