Title :
Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
Author :
Falat, Tomasz ; Platek, Bartosz ; Matkowski, Przemysław ; Felba, Jan ; Zanden, Carl ; Li-lei Ye ; Liu, Jiangchuan
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
Abstract :
Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the parabolic low, which indicates that the growth was mainly controlled by volume diffusion.
Keywords :
copper alloys; diffusion; indium alloys; molecular dynamics method; solders; In-Cu; copper; indium; intermetallic compounds growth; molecular dynamics simulations; parabolic low; power LED systems; solder material; temperature 400 K; thermal interface; volume diffusion; Aging; Compounds; Copper; Indium; Intermetallic; Materials; Soldering;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028372
