DocumentCode :
2729257
Title :
Performance and reliability of short-channel MOSFETs with superior oxynitride gate dielectrics fabricated using multiple rapid thermal processing
Author :
Shih, D.K. ; Lo, G.Q. ; Ting, W. ; Kwong, D.L.
Author_Institution :
Texas Univ., Austin, TX, USA
fYear :
1989
fDate :
17-19 May 1989
Firstpage :
197
Lastpage :
201
Abstract :
The electrical characteristics of ultrathin oxynitride gate dielectrics prepared by in-situ multiple rapid thermal processing in reactive ambient (O2 and NH3) have been studied. Specifically, the conduction mechanism, charge trapping properties, time-dependent breakdown and interface hardness in oxynitride films have been characterized as a function of both RTO (rapid thermal reoxidation) and RTN (rapid thermal nitridation) processing parameters. In addition, N-channel MOSFETs have been fabricated using oxynitrides as gate dielectrics and their hot carrier immunity has been examined and compared with that of devices using pure thermal oxides. Devices with superior electrical characteristics and reliability have been produced by optimizing RTO/RTN parameters
Keywords :
dielectric thin films; hot carriers; insulated gate field effect transistors; oxidation; reliability; charge trapping properties; conduction mechanism; electrical characteristics; gate dielectrics; hot carrier immunity; interface hardness; multiple rapid thermal processing; oxynitride gate dielectrics; rapid thermal nitridation; rapid thermal reoxidation; reactive ambient; reliability; short-channel MOSFETs; thermal oxides; time-dependent breakdown; Annealing; Conductive films; Dielectric devices; Electric breakdown; Electric variables; Fabrication; Hot carriers; MOSFETs; Nitrogen; Rapid thermal processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
Conference_Location :
Taipei
Type :
conf
DOI :
10.1109/VTSA.1989.68613
Filename :
68613
Link To Document :
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