Title :
Tiny Pitts are the Yield Major Killer Caused by Metal Contamination in Wet Bench Cleaning
Author :
Chen, Sheng-Hsiung ; Chen, Shen-Li ; Chung, Long-Yeu ; Yeh, Wen-Kuan
Author_Institution :
Dept. of Electr. Eng., Tung Fang Inst. of Technol., Kaohsiung
Abstract :
In this paper, we analyzed the contamination of heavy metals on process wafers before gate oxide deposition. A lot of mushrooms-like defects were easy found in wafer edge. And at that time, a lot of pits also can be found in active region of device, as the silicon substrate had been with heavy metallic contamination. TEM and EDS analysis were used to examine the mushrooms type defects and pits defects. A reasonable mechanism was proposed to check the problem stage of manufacturing process
Keywords :
semiconductor device manufacture; surface cleaning; surface contamination; transmission electron microscopy; EDS; TEM; gate oxide deposition; heavy metals; metal contamination; mushroom like defects; process wafers; tiny pits; wet bench cleaning; Chemical processes; Cleaning; Gases; Inorganic materials; Iron; Manufacturing processes; Semiconductor device manufacture; Silicon; Surface contamination; Ultra large scale integration;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
1-4244-0205-0
Electronic_ISBN :
1-4244-0206-9
DOI :
10.1109/IPFA.2006.251013
