TetraMax Diagnosis and Laker Software on Failure Analysis For ATPG/Scan Failures

Author

Boon, Ang Ghim ; Kit, Chan Choon ; Keng, Chua Kok ; Khiam, Oh Chong

Author_Institution

Chartered Semicond. Mfg. Ltd., Singapore

fYear

2006

fDate

3-7 July 2006

Firstpage

217

Lastpage

221

Abstract

Scan/ATPG failures have been one of the main failures contributing to low yield issues and problems in microelectronics. In this paper, the beauty of the TetraMax diagnosis together with the Laker diagnosis software which serve as a complement was discussed, as they are one of the key diagnosis tools currently in the industry to analyze the scan/ATPG failures. The concept of the scan test, the files required to run TetraMax diagnosis, the use of the generated failing nets to convert into failing paths as well as the capability of the Laker software in identifying the particular suspected defective metal, via, poly, contact, active line in the failing path will be discussed together with case studies to illustrate it. This paper served as a useful reading material to wafer fabrication that has the intention of developing such capability in resolving their ATPG/scan failure issues

Keywords

automatic test pattern generation; automatic test software; boundary scan testing; failure analysis; integrated circuit testing; Laker diagnosis software; TetraMax diagnosis; automatic test pattern generation; failure analysis; scan failures; wafer fabrication; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Failure analysis; Flip-flops; Lakes; Logic testing; Microelectronics; Software testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the

Conference_Location

Singapore

Print_ISBN

1-4244-0205-0

Electronic_ISBN

1-4244-0206-9

Type

conf

DOI

10.1109/IPFA.2006.251034

Filename

4017059