DocumentCode
2730087
Title
Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography
Author
Hechtl, M. ; Steckert, G. ; Keller, C.
Author_Institution
Infineon Technol., Munich
fYear
2006
fDate
3-7 July 2006
Firstpage
252
Lastpage
255
Abstract
Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of results
Keywords
SQUIDs; infrared imaging; magnetic force microscopy; system-in-package; electrical shorts; lock-in-IR thermography; magnetic microscopy; scanning SQUID microscopy; Failure analysis; Metallization; Micromagnetics; Microscopy; SQUIDs; Semiconductor device packaging; Semiconductor devices; Signal processing; Stimulated emission; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
Conference_Location
Singapore
Print_ISBN
1-4244-0205-0
Electronic_ISBN
1-4244-0206-9
Type
conf
DOI
10.1109/IPFA.2006.251041
Filename
4017066
Link To Document