DocumentCode
2730088
Title
glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects
Author
Schröder, H. ; Brusberg, L. ; Erxleben, R. ; Ndip, I. ; Töpper, M. ; Nissen, N.F. ; Reichl, H.
Author_Institution
Fraunhofer IZM, Berlin, Germany
fYear
2010
fDate
1-4 June 2010
Firstpage
1647
Lastpage
1652
Abstract
We introduce thin glass for electrical-optical integration on module level. Glass is regarded as promising material for high frequency wiring to drive the e/o components having additional advantages in terms of transparency, waveguide and lens integration capability and PCB integration. Modeling results of vertical and horizontal electrical interconnects show the suitability for certain configurations. The integration schemes will be discussed and experimental results from thin film deposition, laser drilling of through vias and ion exchange for optical waveguides will be presented.
Keywords
Frequency; Glass; Laser modes; Lenses; Optical interconnections; Optical materials; Optical waveguide components; Optical waveguides; Sputtering; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV, USA
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490760
Filename
5490760
Link To Document