Terahertz packaging: Study of substrates for novel component designs

This paper will examine a new side to packaging: Terahertz (THz) Packaging. The goal of this paper is three fold: 1) characterizing dielectric materials for THz packaging applications; 2) Using these materials in the fabrication of THz passives (integrated and quasi-optical); and 3) Demonstrating non-destructive evaluation of packages using THz. In this manuscript, detailed characteristics of dielectric packaging materials in the THz spectral region are presented along with the theory used for the characterization procedure. THz non destructive evaluation (NDE) of electronics packages is observed in the form of delamination thickness detection and moisture content studies. Using the materials characterized, a planar THz power splitter and a quasi-optical THz bandstop interference filter are demonstrated. Furthermore, the power splitter is used as a THz microfluidic sensor.