DocumentCode
2730142
Title
Integrated power electronics using a ferrite-based low-temperature co-fired ceramic materials system
Author
Roesler, Alex ; Schare, Josh ; Hettler, Chad
Author_Institution
Sandia National Laboratories Albuquerque, NM, Dave Abel, George Slama and Daryl Schofield NASCEN Technology Watertown, SD
fYear
2010
fDate
1-4 June 2010
Firstpage
720
Lastpage
726
Abstract
This paper discusses a new approach to making hybrid power electronic circuits by combining a low-temperature (850°C to 950°C) co-fired ceramic (LTCC) substrate, planar LTCC ferrite transformers/inductors and integrated passive components into a multilayer monolithic package using a ferrite-based LTCC material system. A ferrite tape functions as the base material for this LTCC system. The material system includes physically and chemically compatible dielectric paste, dielectric tape and conductor materials which can be co-fired with the base ferrite LTCC tape to create sintered devices with excellent magnetic coupling, high permeability (~400), high resistivity (> 1012 Ω·cm) and good saturation (~0.3 T). The co-fired ferrite and dielectric materials can be used as a substrate for attaching or housing semiconductor components and other discrete devices that are part of the power electronics system. Furthermore, the ability to co-fire the ferrite with dielectric and conductor materials allows for the incorporation of embedded passives in the multilayer structure to create hybrid power electronic circuits. Overall this thick film material set offers a unique approach to making hybrid power electronics and could potentially allow a size reduction for many commercial dc-dc converter and other power electronic circuits.
Keywords
Ceramics; Circuits; Conducting materials; Dielectric devices; Dielectric materials; Dielectric substrates; Ferrites; Magnetic materials; Nonhomogeneous media; Power electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV, USA
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490764
Filename
5490764
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