• DocumentCode
    2730142
  • Title

    Integrated power electronics using a ferrite-based low-temperature co-fired ceramic materials system

  • Author

    Roesler, Alex ; Schare, Josh ; Hettler, Chad

  • Author_Institution
    Sandia National Laboratories Albuquerque, NM, Dave Abel, George Slama and Daryl Schofield NASCEN Technology Watertown, SD
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    720
  • Lastpage
    726
  • Abstract
    This paper discusses a new approach to making hybrid power electronic circuits by combining a low-temperature (850°C to 950°C) co-fired ceramic (LTCC) substrate, planar LTCC ferrite transformers/inductors and integrated passive components into a multilayer monolithic package using a ferrite-based LTCC material system. A ferrite tape functions as the base material for this LTCC system. The material system includes physically and chemically compatible dielectric paste, dielectric tape and conductor materials which can be co-fired with the base ferrite LTCC tape to create sintered devices with excellent magnetic coupling, high permeability (~400), high resistivity (> 1012 Ω·cm) and good saturation (~0.3 T). The co-fired ferrite and dielectric materials can be used as a substrate for attaching or housing semiconductor components and other discrete devices that are part of the power electronics system. Furthermore, the ability to co-fire the ferrite with dielectric and conductor materials allows for the incorporation of embedded passives in the multilayer structure to create hybrid power electronic circuits. Overall this thick film material set offers a unique approach to making hybrid power electronics and could potentially allow a size reduction for many commercial dc-dc converter and other power electronic circuits.
  • Keywords
    Ceramics; Circuits; Conducting materials; Dielectric devices; Dielectric materials; Dielectric substrates; Ferrites; Magnetic materials; Nonhomogeneous media; Power electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490764
  • Filename
    5490764