DocumentCode
2730251
Title
Comparison of material selection methods for lead-frame package encapsulation of integrated circuits
Author
Ragaie, H.F. ; Sakr, Salam
fYear
1998
fDate
24-26 Feb 1998
Abstract
This paper proposes a comparative study of material selection methods as applied to lead-frame package encapsulation of integrated circuits. The chart selection method has been found to be a suitable solution to find the nearest material fulfilling the property constraints on materials
Keywords
encapsulation; integrated circuit packaging; chart selection method; lead-frame package encapsulation; material selection methods; property constraints; Encapsulation; Integrated circuit packaging; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Science Conference, 1998. NRSC '98. Proceedings of the Fifteenth National
Conference_Location
Cairo
Print_ISBN
0-7803-5121-5
Type
conf
DOI
10.1109/NRSC.1998.711516
Filename
711516
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