Title :
Comparison of material selection methods for lead-frame package encapsulation of integrated circuits
Author :
Ragaie, H.F. ; Sakr, Salam
Abstract :
This paper proposes a comparative study of material selection methods as applied to lead-frame package encapsulation of integrated circuits. The chart selection method has been found to be a suitable solution to find the nearest material fulfilling the property constraints on materials
Keywords :
encapsulation; integrated circuit packaging; chart selection method; lead-frame package encapsulation; material selection methods; property constraints; Encapsulation; Integrated circuit packaging; Temperature;
Conference_Titel :
Radio Science Conference, 1998. NRSC '98. Proceedings of the Fifteenth National
Conference_Location :
Cairo
Print_ISBN :
0-7803-5121-5
DOI :
10.1109/NRSC.1998.711516
