Title :
2006 IEEE International Reliability Physics Symposium Proceedings 44th Annual
Abstract :
The following topics are dealt with: products & dielectrics; compound devices; interconnect; ESD/latchup; high-k; soft error rates; assembly & packaging; products & circuits; high voltage devices; process integration reliability; MEMS; memory; transistors; BEOL dielectrics; and failure analysis
Keywords :
dielectric materials; electrostatic discharge; failure analysis; high-k dielectric thin films; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; micromechanical devices; power semiconductor devices; BEOL dielectrics; ESD; MEMS; assembly; compound devices; failure analysis; high voltage devices; high-k; interconnect; latchup; memory; packaging; process integration reliability; reliability physics; soft error rates; transistors;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
DOI :
10.1109/RELPHY.2006.251361
