• DocumentCode
    2730747
  • Title

    Post-Breakdown Characteristics of Extrinsic Failure Modes for Ultra-Thin Gate Oxides

  • Author

    Wu, Ernest ; Suné, Jordi

  • Author_Institution
    IBM Microelectron. Div., Essex Junction, VT
  • fYear
    2006
  • fDate
    26-30 March 2006
  • Firstpage
    36
  • Lastpage
    45
  • Abstract
    In this work, we show that the post-breakdown behavior of the extrinsic breakdown (BD) mode in ultra-thin gate oxides exhibits the same characteristics as the intrinsic breakdown mode. Although the first BD statistical time to breakdown distributions of intrinsic and extrinsic populations are inherently different, our results indicate that the progressive BD distribution, its voltage acceleration, and temperature activation are roughly identical for both extrinsic and intrinsic samples. These results reveal that the post-BD wear out mechanisms that precede the circuit failure are the same for the BD paths initiated by either intrinsic or extrinsic BD events
  • Keywords
    failure analysis; semiconductor device breakdown; extrinsic failure modes; post-breakdown characteristics; progressive BD distribution; temperature activation; ultra-thin gate oxides; voltage acceleration; Acceleration; Breakdown voltage; Circuits; Current distribution; Electric breakdown; Leakage current; Microelectronics; Stress; Temperature distribution; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9498-4
  • Electronic_ISBN
    0-7803-9499-2
  • Type

    conf

  • DOI
    10.1109/RELPHY.2006.251189
  • Filename
    4017130