DocumentCode
2730747
Title
Post-Breakdown Characteristics of Extrinsic Failure Modes for Ultra-Thin Gate Oxides
Author
Wu, Ernest ; Suné, Jordi
Author_Institution
IBM Microelectron. Div., Essex Junction, VT
fYear
2006
fDate
26-30 March 2006
Firstpage
36
Lastpage
45
Abstract
In this work, we show that the post-breakdown behavior of the extrinsic breakdown (BD) mode in ultra-thin gate oxides exhibits the same characteristics as the intrinsic breakdown mode. Although the first BD statistical time to breakdown distributions of intrinsic and extrinsic populations are inherently different, our results indicate that the progressive BD distribution, its voltage acceleration, and temperature activation are roughly identical for both extrinsic and intrinsic samples. These results reveal that the post-BD wear out mechanisms that precede the circuit failure are the same for the BD paths initiated by either intrinsic or extrinsic BD events
Keywords
failure analysis; semiconductor device breakdown; extrinsic failure modes; post-breakdown characteristics; progressive BD distribution; temperature activation; ultra-thin gate oxides; voltage acceleration; Acceleration; Breakdown voltage; Circuits; Current distribution; Electric breakdown; Leakage current; Microelectronics; Stress; Temperature distribution; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251189
Filename
4017130
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