Title :
Adhesive bond analysis using electromagnetic acoustic transducers (EMATs)
Author :
Dixon, S. ; Edwards, C. ; Palmer, S.B.
Author_Institution :
Dept. of Phys., Warwick Univ., Coventry, UK
Abstract :
Shows how EMATs have been successfully used to perform non-contact ultrasonic tests on bonded aerospace aluminium plates and how they may also be used to monitor adhesive cure. Several defect types were successfully identified and the adhesive thickness could also be measured which not only allows some compensation for attenuation within the adhesive, but also provides a useful measurement in itself
Keywords :
aluminium; Al; adhesive bond analysis; adhesive cure; adhesive thickness; attenuation; bonded aerospace Al plates; defect types; electromagnetic acoustic transducers; noncontact ultrasonic tests;
Conference_Titel :
Inspection of Bonded Structures (Digest No. 1997/008), IEE Colloquium on Techniques for the
Conference_Location :
London
DOI :
10.1049/ic:19970053
