• DocumentCode
    2730836
  • Title

    SOI technology performance and modelling

  • Author

    Pelloie, J.L. ; Auberton-Herv, A.J. ; Raynaud, C. ; Faynot, O.

  • Author_Institution
    CEA, Centre d´Etudes Nucleaires de Grenoble, France
  • fYear
    1999
  • fDate
    17-17 Feb. 1999
  • Firstpage
    428
  • Lastpage
    429
  • Abstract
    Power consumption is now a major concern for high-performance digital systems and portable applications. The most efficient technological approach for reducing power consumption is power-supply voltage (V/sub dd/) scaling. Threshold voltage (V/sub t/) must consequently be reduced to maintain speed but its lowest value is set by the maximum tolerable off-current (I/sub off/). Various SOI device architectures (fully-depleted or FD, partially or non-fully depleted or PD) are suggested and used either for high-speed or low-power applications. Emergence of CMOS/SOI technologies was not possible in the past because of the lack of a reliable SOI substrate in large quantities. SIMOX substrate quality is improved, and SOI substrates are now available using different wafer-bonding techniques. From a technology point of view, SOI is now mature enough to be used in commercial products.
  • Keywords
    digital integrated circuits; integrated circuit modelling; integrated circuit technology; low-power electronics; silicon-on-insulator; wafer bonding; SIMOX substrate quality; SOI technology; fully-depleted; high-performance digital systems; low-power applications; maximum tolerable off-current; nonfully depleted; portable applications; power consumption; power-supply voltage scaling; threshold voltage; wafer-bonding techniques; Inverters; Length measurement; MOSFET circuits; Solid modeling; Solid state circuits; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1999. Digest of Technical Papers. ISSCC. 1999 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5126-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.1999.759338
  • Filename
    759338