• DocumentCode
    2730855
  • Title

    Voltage Acceleration of TBD and Its Correlation to Post Breakdown Conductivity of N- and P-Channel MOSFETs

  • Author

    Röhner, M. ; Kerber, A. ; Kerber, M.

  • Author_Institution
    Infineon Technol., Munich
  • fYear
    2006
  • fDate
    26-30 March 2006
  • Firstpage
    76
  • Lastpage
    81
  • Abstract
    The gate oxide breakdown behavior of advanced n- and p-channel CMOS devices was thoroughly investigated from the time range of electrical overstress events (mus) to package level test conditions (106 s). The voltage acceleration follows the power-law-model over 12 decades in time. In addition the current-voltage driven wear out was studied for linear and non-linear driver elements. It was found that the evolution of the post breakdown conductivity strongly depends on the current limitation and the associated voltage drop across the driving stage. The post breakdown evolution can be described by the intrinsic voltage acceleration model
  • Keywords
    MOSFET; semiconductor device breakdown; semiconductor device reliability; MOSFET; TBD; current limitation; dielectric breakdown; electrical overstress events; oxide reliability; package level test conditions; post breakdown conductivity; voltage acceleration; Acceleration; Breakdown voltage; Conductivity; Dielectric breakdown; Electric breakdown; Life estimation; MOSFETs; Packaging; Pulse measurements; Stress; dielectric breakdown; oxide reliability; voltage accelerations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9498-4
  • Electronic_ISBN
    0-7803-9499-2
  • Type

    conf

  • DOI
    10.1109/RELPHY.2006.251194
  • Filename
    4017135