DocumentCode
2730855
Title
Voltage Acceleration of TBD and Its Correlation to Post Breakdown Conductivity of N- and P-Channel MOSFETs
Author
Röhner, M. ; Kerber, A. ; Kerber, M.
Author_Institution
Infineon Technol., Munich
fYear
2006
fDate
26-30 March 2006
Firstpage
76
Lastpage
81
Abstract
The gate oxide breakdown behavior of advanced n- and p-channel CMOS devices was thoroughly investigated from the time range of electrical overstress events (mus) to package level test conditions (106 s). The voltage acceleration follows the power-law-model over 12 decades in time. In addition the current-voltage driven wear out was studied for linear and non-linear driver elements. It was found that the evolution of the post breakdown conductivity strongly depends on the current limitation and the associated voltage drop across the driving stage. The post breakdown evolution can be described by the intrinsic voltage acceleration model
Keywords
MOSFET; semiconductor device breakdown; semiconductor device reliability; MOSFET; TBD; current limitation; dielectric breakdown; electrical overstress events; oxide reliability; package level test conditions; post breakdown conductivity; voltage acceleration; Acceleration; Breakdown voltage; Conductivity; Dielectric breakdown; Electric breakdown; Life estimation; MOSFETs; Packaging; Pulse measurements; Stress; dielectric breakdown; oxide reliability; voltage accelerations;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251194
Filename
4017135
Link To Document