Title :
A low-cost QFP design for over 8Gbps SerDes applications with inductive return path co-planar waveguide built into the lead frame
Author_Institution :
NEC Electron. Corp., Kawasaki, Japan
Abstract :
In order to overcome large impedance discontinuities and crosstalk issues observed in the low-cost QFP, a new design scheme called inductive return path co-planar waveguide is proposed, which distributed circuit structure works a passive impedance equalizer at the same time reduces crosstalk necessary to achieve over-10Gbps signal transmission. The proposed design scheme has been applied to an exposed die-pad type TQFP, which has achieved successful 12.8Gbps differential signal transmission. Because this distributed circuit design needs only a small layout space, it is suitable to achieving compact and low-cost consumer device packaging. Additionally this design scheme is applicable not to only the TQFP but also to normal QFP.
Keywords :
Bonding; Circuits; Coplanar waveguides; Crosstalk; Electronics packaging; Impedance; Lead; Parasitic capacitance; Signal design; Waveguide discontinuities;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2010.5490801