Title :
High temperature superconductors-electrical considerations and possible applications in microelectronics
Author :
Dümcke, R. ; Fotheringham, G. ; Reichl, Herbert
Author_Institution :
Tech. Univ., Berlin, West Germany
Abstract :
The impact of VLSI integration trends on the requirements of chip-to-chip interconnects is reviewed. The propagation of on-chip and off-chip interconnection systems at liquid nitrogen temperatures are discussed for signal and power lines. Material properties of high T c-superconductors are considered and the resulting changes for transmission-line properties of superconducting interconnects are pointed out. Possible applications and some open problems are discussed
Keywords :
VLSI; high-temperature superconductors; integrated circuit technology; lead bonding; IC technology; VLSI; chip-to-chip interconnects; high Tc-superconductors; high temperature superconductors; liquid N2 temperature; microelectronics; off-chip; on-chip; superconducting interconnects; transmission-line properties; Bonding; Capacitance; Conductors; Delay; Frequency; High temperature superconductors; Integrated circuit interconnections; Power system interconnection; Superconducting transmission lines; Very large scale integration;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75940
