High temperature superconductors-electrical considerations and possible applications in microelectronics

Author

Dümcke, R. ; Fotheringham, G. ; Reichl, Herbert

Author_Institution

Tech. Univ., Berlin, West Germany

fYear

1988

fDate

13-15 Jun 1988

Firstpage

1

Lastpage

5

Abstract

The impact of VLSI integration trends on the requirements of chip-to-chip interconnects is reviewed. The propagation of on-chip and off-chip interconnection systems at liquid nitrogen temperatures are discussed for signal and power lines. Material properties of high T _c-superconductors are considered and the resulting changes for transmission-line properties of superconducting interconnects are pointed out. Possible applications and some open problems are discussed

Keywords

VLSI; high-temperature superconductors; integrated circuit technology; lead bonding; IC technology; VLSI; chip-to-chip interconnects; high T_c-superconductors; high temperature superconductors; liquid N₂ temperature; microelectronics; off-chip; on-chip; superconducting interconnects; transmission-line properties; Bonding; Capacitance; Conductors; Delay; Frequency; High temperature superconductors; Integrated circuit interconnections; Power system interconnection; Superconducting transmission lines; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International

Conference_Location

Neuilly sur Seine

Type

conf

DOI

10.1109/EEMTS.1988.75940

Filename

75940