Title :
Laser interconnections on silicon
Author_Institution :
CEA-CENG/LETI-MSC, Grenoble
Abstract :
Laser techniques for reconfiguration (i.e. cutting or linking) of aluminum conductors on silicon wafer-scale integrated circuits are discussed
Keywords :
aluminium; cutting; elemental semiconductors; integrated circuit technology; laser beam machining; silicon; Al conductors; Si; cutting; laser interconnections; linking; wafer-scale integrated circuits; Absorption; CMOS technology; Fuses; Integrated circuit interconnections; Laser beam cutting; Laser theory; Random access memory; Semiconductor lasers; Silicon; Wafer scale integration;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75941
