Multilayer ceramic circuit boards with copper conductors

Author

Nobuo, Kamehara ; Aoki, Shigehisa ; Imanaka, Y. ; Niwa, Kenta

Author_Institution

Fujitsu Labs., Kanagawa, Japan

fYear

1988

fDate

13-15 Jun 1988

Firstpage

10

Lastpage

13

Abstract

The application of copper (Cu) to multilayer ceramic circuit boards fabricated by the green-sheet method is studied. The glass-ceramic composite composed of borosilicate (B₂O₃-SiO₂) glass and alumina (Al₂O₃) densifies below the melting point of Cu. The major technical difficulty is to fire the circuit board without Cu oxidation and carbon residue. Carbon intermixes with the glass matrix, lowering the fired density, flexural strength, and breakdown voltage. However, less than 100 p.p.m. of carbon does not influence these properties. A 30-layer ceramic circuit board with a carbon concentration of less than 30 p.p.m. has been fabricated. The signal propagation delay time is 7.3 ns/m. The sheet resistivity of Cu conductors is 1.2 mΩ/□

Keywords

alumina; borosilicate glasses; composite materials; copper; packaging; printed circuit manufacture; 30-layer ceramic circuit board; B₂O₃-SiO₂-Al₂O₃; Cu; PCB manufacture; glass-ceramic composite; green-sheet method; multilayer ceramic circuit boards; Ceramics; Conductors; Copper; Fires; Flexible printed circuits; Glass; Nonhomogeneous media; Oxidation; Printed circuits; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International

Conference_Location

Neuilly sur Seine

Type

conf

DOI

10.1109/EEMTS.1988.75942

Filename

75942