3D mobile CPU system assembly by Z-axis stack connector solutions

Module daughter cards are conventional approach in electronic integrated system solutions. Applying same principals for CPU products was abandoned some generations ago, yet may still hold some potential for concurrent and future products. Board to board stack connectors may allow growing the interface pin count versus conventional edge connectors. This alternative assembly scheme can offer competitive mechanical height and peripheral integrated chips performance versus the common PGA CPU sockets. Key area for performance boost may be the memory interface.