DocumentCode :
2731412
Title :
P-channel devices for half-micron CMOS: advantages of high-energy channel implantations
Author :
Woerlee, P.H. ; Walker, A.J. ; Burgmans, A.L.J.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
fYear :
1989
fDate :
17-19 May 1989
Firstpage :
213
Lastpage :
216
Abstract :
The design and the characterization of p-channel devices for half-micron CMOS (complementary metal-oxide-semiconductor) with n+ -silicon gate material are described. Retrograde well technology is used in the fabrication for improved control of the short-channel effects. Excellent behavior has been observed for devices with effective channel length down to 0.4 μm. The properties of the buried channel devices are compared with those of the competing p+-gate surface channel devices. Hot carrier effects are discussed
Keywords :
CMOS integrated circuits; VLSI; integrated circuit technology; 0.5 micron; buried channel devices; effective channel length; half-micron CMOS; high-energy channel implantations; hot carriers; n+-silicon gate material; p-channel devices; p+-gate surface channel devices; retrograde well technology; short-channel effects; CMOS technology; Degradation; Doping; Fabrication; Hot carriers; Implants; Laboratories; Leakage current; Lithography; MOS devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
Conference_Location :
Taipei
Type :
conf
DOI :
10.1109/VTSA.1989.68616
Filename :
68616
Link To Document :
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