DocumentCode
2731439
Title
Parylene C-based flexible interface for neuroprosthetic applications
Author
Bhandari, Rajmohan ; Negi, Sandeep ; Van Wagenen, R. ; Solzbacher, Florian
Author_Institution
Blackrock Microsyst., Salt Lake City, UT, USA
fYear
2010
fDate
1-4 June 2010
Firstpage
1010
Lastpage
1014
Abstract
Microfabricated microelectrode arrays are used to record and stimulate neurons and nerve axons in the central and peripheral nervous systems. Advances in silicon micromachining have brought forth new configurations of microelectrode structures, such as the Utah Electrode Array (UEA). This paper presents a novel monolithic integration technology to realize a flexible neural interface in which a biocompatible polymer (Parylene-C) mechanically connects the UEA and a100-channel implantable connector system (ICS-96). An integration concept for such a device was developed, and the materials and methods used to implement this concept were investigated. Thin film metal (Au) provides the electrical connection between the UEA and the ICS-96. Au metal traces are sandwiched between the Parylene-C layers. The vapor phase, room temperature polymerization of Parylene lends itself well to constructing extremely thin, flexible and pin-hole free polymer films free of additives.
Keywords
biomedical electrodes; biomedical materials; gold; microelectrodes; micromachining; neurophysiology; polymer films; prosthetics; ICS-96; UEA; Utah Electrode Array; biocompatible polymer; central nervous system; electrical connection; implantable connector system; microelectrode structures; microfabricated microelectrode arrays; nerve axons; neurons; neuroprosthetic applications; parylene C-based flexible interface; peripheral nervous system; pin-hole free polymer films; silicon micromachining; thin film metal; Electrodes; Gold; Microelectrodes; Micromachining; Nerve fibers; Nervous system; Neural prosthesis; Neurons; Polymer films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490825
Filename
5490825
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