DocumentCode
273152
Title
New heat resistant dielectric film
Author
Boiteux, G. ; Oraison, J.M. ; Seytre, G. ; Senneron, M. ; Sillion, B.
Author_Institution
Univ. Claude Bernard, Lyon, France
fYear
1988
fDate
27-30 Jun 1988
Firstpage
163
Lastpage
166
Abstract
Among the heat resistant polymers, polyimides are the most popular. In spite of all the work performed on polyimides, these materials still exhibit certain shortcomings such as good processability. An approach to improve the processability involves the synthesis of fully cyclized linear polyimides with a good solubility. For this one can introduce in the main chain flexible linkage (either, carbonyl, sulfone), lateral groups with large steric hindrance or polar groups giving strong interactions with solvent. However, this increase of flexibility induces a lowering of thermostability and glass transition. The incorporation of cardo fluorene provides linear polymers with relatively high Tg and good solubility. In the present study the authors have synthetized a soluble heterocyclic polymer coming from di-9,9´(4 aminophenyl fluorene), DAPF. The authors discuss the synthesis and the mechanical, thermal and dielectric properties of the BTDA/DAPF copolymers
Keywords
dielectric losses; elongation; glass transition (polymers); permittivity; polymer blends; polymer films; 3,3´, 4-4´ dianhydride benzophenone tetracarboxylic; BTDA/DAPF copolymers; N methyl pyrrolidone; cardo fluorene; di-9,9´(4 aminophenyl fluorene); dielectric constant; dielectric loss; dielectric properties; glass transition; heat resistant dielectric film; heat resistant polymers; polar groups; processability; soluble heterocyclic polymer; thermostability;
fLanguage
English
Publisher
iet
Conference_Titel
Dielectric Materials, Measurements and Applications, 1988., Fifth International Conference on
Conference_Location
Canterbury
Print_ISBN
0-85296-359-9
Type
conf
Filename
9449
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