DocumentCode
2731604
Title
Ambient Use-Condition Models for Reliability Assessment
Author
Gu, Chen ; Kwasnick, Robert F. ; Mielke, Neal R. ; Monroe, Eric M. ; Shirley, C. Glenn
Author_Institution
Intel Corp., Hillsboro, OR
fYear
2006
fDate
26-30 March 2006
Firstpage
299
Lastpage
306
Abstract
We describe methods of computing reliability acceleration for realistic temperature/humidity use-condition models. We extract outdoor temperature/humidity models based on NOAA data, and indoor and automotive interior models by using the NOAA data combined with additional data which characterizes thermal and human behavior (thermostat settings). We compare predictions of these models with traditional reliability assessments, and provide useful models to represent the results
Keywords
failure analysis; humidity; semiconductor device models; semiconductor device reliability; humidity use-condition model; reliability assessment; temperature use-condition model; Acceleration; Automotive engineering; Data mining; Failure analysis; Humans; Humidity; Predictive models; Statistics; Temperature distribution; Thermostats;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251232
Filename
4017173
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