Title :
Ambient Use-Condition Models for Reliability Assessment
Author :
Gu, Chen ; Kwasnick, Robert F. ; Mielke, Neal R. ; Monroe, Eric M. ; Shirley, C. Glenn
Author_Institution :
Intel Corp., Hillsboro, OR
Abstract :
We describe methods of computing reliability acceleration for realistic temperature/humidity use-condition models. We extract outdoor temperature/humidity models based on NOAA data, and indoor and automotive interior models by using the NOAA data combined with additional data which characterizes thermal and human behavior (thermostat settings). We compare predictions of these models with traditional reliability assessments, and provide useful models to represent the results
Keywords :
failure analysis; humidity; semiconductor device models; semiconductor device reliability; humidity use-condition model; reliability assessment; temperature use-condition model; Acceleration; Automotive engineering; Data mining; Failure analysis; Humans; Humidity; Predictive models; Statistics; Temperature distribution; Thermostats;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
DOI :
10.1109/RELPHY.2006.251232
