Title :
A SPICE Model of Resistive Random Access Memory for Large-Scale Memory Array Simulation
Author :
Haitong Li ; Peng Huang ; Bin Gao ; Bing Chen ; Xiaoyan Liu ; Jinfeng Kang
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
A SPICE model of oxide-based resistive random access memory (RRAM) for dc and transient behaviors is developed based on the conductive filament evolution model and is implemented in large-scale array simulation. The simulations of one transistor-one resistor RRAM array up to 16 kb with wire resistance (Rwire) and capacitance (Cwire) indicate that: 1) resistance-capacitance delay during RESET and leakage current during SET have significant impact on write operations; 2) with array size enlarging, the power dissipation increases during RESET but decreases during SET; and 3) the increased Rwire and Cwire lead to the degradation of high resistance state and the fluctuation of low resistance state, respectively.
Keywords :
SPICE; leakage currents; random-access storage; wires (electric); RESET; SPICE model; conductive filament evolution; dc behavior; large-scale array; large-scale memory array simulation; leakage current; one transistor-one resistor RRAM array; oxide-based resistive random access memory RRAM; power dissipation; resistance-capacitance delay; transient behavior; wire capacitance; wire resistance; Arrays; Integrated circuit modeling; Microprocessors; Power dissipation; Resistance; SPICE; Circuit simulation; SPICE model; memory array; power dissipation; resistive random access memory (RRAM);
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2013.2293354