Title :
Impact of Thin WSIX Insertion in Tungsten Polymetal Gate on Gate Oxide Reliability and Gate Contact Resistance
Author :
Sung, Min Gyu ; Lim, Kwan-Yong ; Cho, Heung-Jae ; Lee, Seung Ryong ; Jang, Se-Aug ; Yang, Hong-Seon ; Kim, Kwangok ; Kwak, Noh-Jung ; Sohn, Hyun-Chul ; Kim, Jin Woong
Author_Institution :
R&D Div., Hynix Semicond. Inc., Kyoungki
Abstract :
By inserting thin WSix layer in tungsten poly gate stack we can effectively relieve the mechanical stress of gate hard mask nitride film, which contributes to the better gate oxide reliability and stress-immunity of transistor. This insertion also could prevent the formation of Si-N dielectric layer atop poly-Si, which could lower the contact resistance between poly and tungsten effectively
Keywords :
contact resistance; diffusion barriers; semiconductor device reliability; silicon compounds; tungsten; tungsten compounds; WSix-WN; gate contact resistance; gate oxide reliability; mechanical stress; poly gate stack; stress immunity; thin WSix insertion; tungsten polymetal gate; Chemical vapor deposition; Contact resistance; Electrodes; MOS capacitors; MOSFET circuits; Pattern analysis; Random access memory; Stress; Tin; Tungsten;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
DOI :
10.1109/RELPHY.2006.251247