DocumentCode :
2731878
Title :
Impact of Thin WSIX Insertion in Tungsten Polymetal Gate on Gate Oxide Reliability and Gate Contact Resistance
Author :
Sung, Min Gyu ; Lim, Kwan-Yong ; Cho, Heung-Jae ; Lee, Seung Ryong ; Jang, Se-Aug ; Yang, Hong-Seon ; Kim, Kwangok ; Kwak, Noh-Jung ; Sohn, Hyun-Chul ; Kim, Jin Woong
Author_Institution :
R&D Div., Hynix Semicond. Inc., Kyoungki
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
374
Lastpage :
378
Abstract :
By inserting thin WSix layer in tungsten poly gate stack we can effectively relieve the mechanical stress of gate hard mask nitride film, which contributes to the better gate oxide reliability and stress-immunity of transistor. This insertion also could prevent the formation of Si-N dielectric layer atop poly-Si, which could lower the contact resistance between poly and tungsten effectively
Keywords :
contact resistance; diffusion barriers; semiconductor device reliability; silicon compounds; tungsten; tungsten compounds; WSix-WN; gate contact resistance; gate oxide reliability; mechanical stress; poly gate stack; stress immunity; thin WSix insertion; tungsten polymetal gate; Chemical vapor deposition; Contact resistance; Electrodes; MOS capacitors; MOSFET circuits; Pattern analysis; Random access memory; Stress; Tin; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251247
Filename :
4017187
Link To Document :
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