• DocumentCode
    2731992
  • Title

    Internal ringing effect in capacitive micromachined Ultrasonic Transducer

  • Author

    Salim, M.S. ; Malek, M. F Abd ; Heng, R.B.W. ; Sabri Salim, N.

  • Author_Institution
    Sch. of Mechatron. Eng., Univ. Malaysia Perlis, Kangar, Malaysia
  • fYear
    2011
  • fDate
    25-28 Sept. 2011
  • Firstpage
    601
  • Lastpage
    605
  • Abstract
    The effect of internally resonance at silicon substrate in capacitive micromachined Ultrasonic Transducer presented using Experimental and theoretical calculation. This ringing is clearly observed in immersion transducers with 4.2 MHz. A mathematical analytical model of the attenuation yield by ringing effective and simulation has been introduced. Experimental results are further compared to simulations carried out in time-domain and qualitative agreement is evidence. The insights gained from the simulations and experiments will be use to improve the analytic echoscope. The capacitive micromachined Ultrasonic Transducer whose ringing mode is successfully eliminated with backing layer.
  • Keywords
    capacitive sensors; micromechanical devices; ultrasonic transducers; analytic echoscope; capacitive micromachined ultrasonic transducer; internal ringing effect; silicon substrate; Acoustics; Attenuation; Attenuation measurement; Frequency measurement; Substrates; Transducers; Ultrasonic variables measurement; Backing Layer; CMUT; Ultrasound Sensor; attenuation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications (ISIEA), 2011 IEEE Symposium on
  • Conference_Location
    Langkawi
  • Print_ISBN
    978-1-4577-1418-4
  • Type

    conf

  • DOI
    10.1109/ISIEA.2011.6108785
  • Filename
    6108785