DocumentCode :
2731992
Title :
Internal ringing effect in capacitive micromachined Ultrasonic Transducer
Author :
Salim, M.S. ; Malek, M. F Abd ; Heng, R.B.W. ; Sabri Salim, N.
Author_Institution :
Sch. of Mechatron. Eng., Univ. Malaysia Perlis, Kangar, Malaysia
fYear :
2011
fDate :
25-28 Sept. 2011
Firstpage :
601
Lastpage :
605
Abstract :
The effect of internally resonance at silicon substrate in capacitive micromachined Ultrasonic Transducer presented using Experimental and theoretical calculation. This ringing is clearly observed in immersion transducers with 4.2 MHz. A mathematical analytical model of the attenuation yield by ringing effective and simulation has been introduced. Experimental results are further compared to simulations carried out in time-domain and qualitative agreement is evidence. The insights gained from the simulations and experiments will be use to improve the analytic echoscope. The capacitive micromachined Ultrasonic Transducer whose ringing mode is successfully eliminated with backing layer.
Keywords :
capacitive sensors; micromechanical devices; ultrasonic transducers; analytic echoscope; capacitive micromachined ultrasonic transducer; internal ringing effect; silicon substrate; Acoustics; Attenuation; Attenuation measurement; Frequency measurement; Substrates; Transducers; Ultrasonic variables measurement; Backing Layer; CMUT; Ultrasound Sensor; attenuation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications (ISIEA), 2011 IEEE Symposium on
Conference_Location :
Langkawi
Print_ISBN :
978-1-4577-1418-4
Type :
conf
DOI :
10.1109/ISIEA.2011.6108785
Filename :
6108785
Link To Document :
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