• DocumentCode
    2732134
  • Title

    Mounting open-via-chip-carriers (for 100 to 300 inputs/outputs i.c.)

  • Author

    Val, C.M.

  • Author_Institution
    Thomson-CSF/CIMSA-SINTRA, Colombes
  • fYear
    1988
  • fDate
    13-15 Jun 1988
  • Firstpage
    34
  • Lastpage
    36
  • Abstract
    Techniques for the efficient soldering of open-via chip-carriers (OVCC) to substrates are discussed. The development is described of OVCCs for the encapsulation of integrated circuits with 300 inputs/outputs
  • Keywords
    encapsulation; integrated circuit technology; soldering; encapsulation; integrated circuits; open-via-chip-carriers; soldering; Electrostatic discharge; Inspection; Instruments; Lead; Optimized production technology; Packaging; Printing; Protection; Soldering; Very high speed integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
  • Conference_Location
    Neuilly sur Seine
  • Type

    conf

  • DOI
    10.1109/EEMTS.1988.75948
  • Filename
    75948
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2732134