Title :
[Copyright notice]
Abstract :
The following topics are dealt with: flip chip packaging; 3D-TSV interconnection; Pb-free solder; intermetallic compounds; optical interconnect; fiber optics; wafer level packaging; wire bonding; bonding interconnect; solder joint reliability; TSV based RF devices; filter; high-power laser; LED; RF packaging; 3D packaging; MEMS technology; nanotechnology; bioelectronics; 3D manufacturing; nanoelectronics; BGA; and chip package interaction.
Keywords :
alloys; ball grid arrays; chip scale packaging; filters; flip-chip devices; integrated circuit interconnections; integrated circuit manufacture; integrated circuit reliability; lasers; lead bonding; light emitting diodes; micromechanical devices; nanotechnology; optical fibres; optical interconnections; solders; three-dimensional integrated circuits; wafer level packaging; 3D manufacturing; 3D packaging; 3D-TSV interconnection; BGA; LED; MEMS technology; Pb-free solder; RF packaging; TSV based RF devices; bioelectronics; bonding interconnect; chip package interaction; fiber optics; filter; flip chip packaging; high-power laser; intermetallic compounds; nanoelectronics; nanotechnology; optical interconnect; solder joint reliability; wafer level packaging; wire bonding;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2010.5490870
