Title :
Compound properties in correlation to dynamic-mechanical measurements of process regulated molding technology
Author :
Draeger, Georg ; Maier, Maria ; Quella, Ferdinand
Author_Institution :
Siemens AG, Munchen, West Germany
Abstract :
The increasing demand for better reliability of encapsulated VLSI requires process-regulated manufacturing, which includes the rheology of materials and the design of the tool. Some typical examples for the optimization are given. For an evaluation of stress formation by different molding compounds, the suitability of shear modulus and thermal expansion, especially of their product vs. temperature, is discussed. The limitations of these values are shown and do some suggestions for the extension of the measurements e.g. to aging are made
Keywords :
VLSI; ageing; encapsulation; integrated circuit technology; reliability; shear modulus; thermal expansion; IC technology; aging; dynamic-mechanical measurements; encapsulated VLSI; optimization; process regulated molding technology; reliability; shear modulus; stress; thermal expansion; Curing; Filling; Materials reliability; Stress measurement; Temperature dependence; Thermal conductivity; Thermal expansion; Thermal stresses; Very large scale integration; Viscosity;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75949
