Compound properties in correlation to dynamic-mechanical measurements of process regulated molding technology

Author

Draeger, Georg ; Maier, Maria ; Quella, Ferdinand

Author_Institution

Siemens AG, Munchen, West Germany

fYear

1988

fDate

13-15 Jun 1988

Firstpage

37

Lastpage

40

Abstract

The increasing demand for better reliability of encapsulated VLSI requires process-regulated manufacturing, which includes the rheology of materials and the design of the tool. Some typical examples for the optimization are given. For an evaluation of stress formation by different molding compounds, the suitability of shear modulus and thermal expansion, especially of their product vs. temperature, is discussed. The limitations of these values are shown and do some suggestions for the extension of the measurements e.g. to aging are made

Keywords

VLSI; ageing; encapsulation; integrated circuit technology; reliability; shear modulus; thermal expansion; IC technology; aging; dynamic-mechanical measurements; encapsulated VLSI; optimization; process regulated molding technology; reliability; shear modulus; stress; thermal expansion; Curing; Filling; Materials reliability; Stress measurement; Temperature dependence; Thermal conductivity; Thermal expansion; Thermal stresses; Very large scale integration; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International

Conference_Location

Neuilly sur Seine

Type

conf

DOI

10.1109/EEMTS.1988.75949

Filename

75949